Odisha Plans 871-Acre ‘Silicon Valley’ as SiC Push Targets EVs

Odisha is planning an around 871-acre semiconductor and electronics manufacturing hub near Naraj, between Bhubaneswar and Cuttack, which Chief Minister Mohan Charan Majhi described as an “Odisha Silicon Valley”.

Speaking at Semicon India 2026 in New Delhi, Majhi said the state is creating a land bank for the proposed hub and has held discussions with around 10-12 companies as it looks to bring more semiconductor and electronics manufacturing to Odisha.

The plan coincides with the development of SiCSem’s silicon carbide, or SiC, semiconductor facility in the state. EVs and fast chargers are among the identified applications for devices to be manufactured at the facility.

SiC brings automotive link

SiCSem is working with UK-based Clas-SiC Wafer Fab to establish an integrated silicon carbide compound semiconductor facility in Odisha. Approved under the India Semiconductor Mission, the project is planned with an annual fabrication capacity of 60,000 wafers and packaging capacity of 96 million units.

Apart from EVs and fast chargers, the devices are intended for applications across railways, defence equipment, data centres, consumer appliances and solar power inverters.

Silicon carbide has emerged as an important power semiconductor technology for electric vehicles, particularly in areas such as traction inverters and power conversion. Its ability to operate efficiently at higher voltages also makes it relevant for fast-charging systems.

The project moved another step forward on September 15 when the Unit Approval Committee of Falta Special Economic Zone approved SiCSem’s proposal for a semiconductor manufacturing unit at IDCO Infovalley-II in Khordha district.

Spread across 21.889 acres, the unit entails an investment of Rs 3,406.25 crore and is proposed to manufacture SiC diodes and SiC MOSFETs. It is expected to generate 1,270 jobs, with annual production envisaged at 4.8 million SiC diodes and 91.2 million SiC MOSFETs.

Building a wider chip base

Odisha is also home to 3D Glass Solutions’ advanced semiconductor packaging project. The Rs 1,943 crore facility is designed for advanced 3D heterogeneous integration using glass substrates and has a planned annual production capacity of 50 million assembled units.

The state is also developing research capabilities around compound semiconductors. SiCSem and IIT Bhubaneswar have been working on indigenous SiC crystal growth, including technology for 150mm and 200mm SiC wafers, aimed at building domestic capability in power semiconductor devices.

For the automotive sector, the SiCSem project gives Odisha’s semiconductor programme a direct link with electric mobility. The proposed 871-acre hub near Naraj would provide the state with additional space to bring semiconductor and electronics manufacturers into the cluster as it looks to build out its chip manufacturing base.