SAEINDIA To Host APAC 23 Automotive Engineering Conference In New Delhi

SAEINDIA will host the 23rd edition of the Asia Pacific Automotive Engineering Conference (APAC 23) at the Yashobhoomi Convention Centre in New Delhi on November 13–14, 2026. The conference is expected to bring together more than 1,000 delegates and 500 mobility experts from across the Asia-Pacific region.

Organised under the theme ‘Xellerating Towards Safe, Secure, Sustainable & Intelligent Mobility’, APAC 23 will focus on developments in automotive engineering, electrification, connected mobility, software-defined vehicles, artificial intelligence and vehicle safety. This will be the second time India hosts the conference, following its previous edition in the country 15 years ago.

The two-day event is expected to feature more than 150 technical presentations and 80 exhibitors, with participation from automotive manufacturers, component suppliers, technology companies, engineering service providers, research institutions, start-ups and government stakeholders.

APAC 23 to Cover Electrification, Software-Defined Vehicles and AI

Technical discussions at the conference will cover future powertrains, automated and connected mobility, cybersecurity, artificial intelligence, software-defined vehicles and digital twins. Other areas on the agenda include vehicle dynamics, human factors, advanced materials, lightweighting, energy efficiency, emissions, life cycle assessment and automotive standards and regulations.

The conference will also feature an exposition, Technology Theatre and TechHive, alongside plenary sessions and technical presentations. The exposition will provide companies with an opportunity to demonstrate automotive technologies, products and engineering capabilities to industry participants.

The Technology Theatre, located within the exposition area, will host presentations on new technologies, product developments and engineering solutions.

TechHive to Provide Platform for Mobility Start-ups

APAC 23 will include TechHive, a dedicated platform for mobility start-ups to present their technologies and engage with automotive companies, investors, potential customers and industry experts.

The initiative is intended to facilitate interaction between emerging businesses and established players in the automotive ecosystem, with a focus on technology development and potential industry collaborations.

SAEINDIA Seeks Greater Asia-Pacific Engineering Collaboration

APAC originated in 1981 as the International Pacific Conference and has since developed into an automotive engineering forum representing 11 countries across the Asia-Pacific region.

SAEINDIA said hosting the conference in India after a 15-year gap is intended to strengthen engagement between the country's automotive engineering ecosystem and regional industry participants. The event will provide opportunities for technical knowledge exchange, research collaboration, partnerships and business development.

The conference is also expected to facilitate discussions between industry, academia, researchers and policymakers on engineering requirements arising from the transition towards electric, connected, automated and software-defined mobility.

SAEINDIA is inviting organisations and professionals to participate through delegate registrations, sponsorships, exhibition spaces and the TechHive programme.