The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). The projects, located in Odisha, Punjab, and Andhra Pradesh, represent a combined investment of approximately ₹4,600 crore and are expected to generate direct employment for over 2,000 skilled professionals.
The approved proposals are from SiCSem Private Limited, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc. (3DGS), and Advanced System in Package (ASIP) Technologies. With these additions, the total number of semiconductor projects approved under the ISM rises to 10, with cumulative investments reaching around ₹1.60 lakh crore across six states.
The government stated that the new facilities will support India’s growing electronics manufacturing sector and contribute to the country’s strategic goal of enhancing self-reliance in semiconductor production. The demand for semiconductors continues to rise across industries such as telecommunications, automotive, data centers, consumer electronics, and industrial systems.
SiCSem Private Limited will establish an integrated Silicon Carbide (SiC) compound semiconductor manufacturing facility in Info Valley, Bhubaneswar, Odisha, in collaboration with Clas-SiC Wafer Fab Ltd. of the UK. This will be India’s first commercial compound semiconductor fabrication unit. The facility is designed to produce 60,000 wafers annually, along with packaging capacity for 96 million units. Applications of the manufactured devices include electric vehicles, railway systems, fast chargers, solar power inverters, defense equipment, and consumer appliances.
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit, also in Info Valley, Bhubaneswar. The facility will introduce advanced packaging technologies to India, including glass interposers with embedded passives, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. It aims to produce around 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually. These components are critical for high-performance computing, artificial intelligence, automotive systems, defense, and photonics applications.
Advanced System in Package (ASIP) Technologies will establish a semiconductor manufacturing unit in Andhra Pradesh, in partnership with APACT Co. Ltd. of South Korea. The facility will have an annual production capacity of 96 million units, with products intended for use in mobile phones, set-top boxes, automotive electronics, and other consumer electronics.
Continental Device India Limited (CDIL) will expand its existing semiconductor facility in Mohali, Punjab. The brownfield expansion will focus on manufacturing high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky diodes, and transistors using both silicon and silicon carbide. The expanded facility will have an annual capacity of 158.38 million units. The devices will be used in electric vehicles, renewable energy systems, power conversion, industrial equipment, and communication infrastructure.
The approval of these projects marks a significant step in India’s efforts to develop a comprehensive semiconductor ecosystem. The inclusion of a compound semiconductor fab and an advanced glass-based packaging unit underscores the country’s push into more complex and high-value segments of the semiconductor value chain.
The India Semiconductor Mission has also supported the development of domestic chip design capabilities. To date, the government has provided design infrastructure support to 278 academic institutions and 72 startups. Over 60,000 students have participated in talent development programs aimed at building a skilled workforce for the semiconductor industry.
The new facilities are expected to catalyze further investments and innovation in electronics manufacturing, while also creating indirect employment opportunities across the supply chain.