STM, Semikron to integrate silicon-carbide power tech EV drives

by Autocar Pro News Desk , 10 May 2022

STMicroelectronics, a global semiconductor company will supply silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron, a leading manufacturer of power modules and systems.

This, the company, says is the result of a four-year technical collaboration between the two companies to design-in ST’s advanced SiC power semiconductors for higher efficiency and industry-benchmark performance in more compact systems.

SiC’s EV  traction drives, says the company, will  contribute to greater driving range and reliability. Semikron recently announced it had secured a billion-Euro (approximately Rs 8,145 crore) contract to supply the eMPack power modules to a major German car maker, beginning in 2025.

Karl-Heinz Gaubatz, CEO and CTO, Semikron said, “ST’s industry-leading SiC device-manufacturing capabilities and in-depth expertise with the technology enabled us to integrate these cutting-edge semiconductors with our advanced manufacturing processes, which enhance reliability, power density, and scalability to meet the needs of the automotive industry. As we now move towards volume-production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance.”

Edoardo Merli, Power Transistor Sub-Group GM and executive VP, STMicroelectronics said, “Leveraging our SiC technology, Semikron’s advanced scalable eMPack family of power modules is ready to make a major contribution towards zero-emission motoring. In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance, and reliability in sustainable energy and industrial power-control applications.”

Engineers from STM and Semikron have come together to integrate the STPOWER SiC MOSFETs, which control power switching in the main EV traction inverter, with Semikron’s fully sintered Direct Pressed Die (DPD) assembly process. DPD enhances module performance and reliability and enables cost-effective power and voltage scaling. Leveraging the parameters of ST’s SiC MOSFETs, supplied as bare dice, Semikron has established 750V and 1200V eMPack platforms, addressing applications from 100kW to 750kW and battery systems from 400V to 800V.