UltraSense Systems releases TouchPoint sensors seamless touch HMI at CES 2021

California-based 3D ultrasound technology-based product company UltraSense Systems has announced a variety of company milestones and product releases at the 2021 Consumer Electronics Show (CES).

The company has started shipping mass production parts of its TouchPoint Z (USZ-10000) 3D ultrasound touch user interface solution to smartphone and consumer product manufacturers. The TouchPoint Z is a 3D ultrasound sensor system-on-chip (SoC) that combines ultrasound and Z-Force detection with a signal processing ASIC for a complete, standalone, virtual button mounted under different metals, plastics, glass and a variety of veneer materials. Measuring just 2.6mm x 1.4mm x 0.5mm (LxWxH), the TouchPoint Z sensor SoC is designed to replace mechanical buttons and cutouts in materials up to 5mm in thickness for a seamless touch user interface.

At CES 2021, UltraSense Systems will demonstrate several of its latest releases to scale its technology for customer adoption across various markets including automotive, home appliances, smartphones and smart wearable devices. The company will provide customers to learn about product updates, advancements, evaluation kits and a smart surface demonstration platform showcasing how to turn surface materials such as metals, glass, leather and wood into digital button surfaces.

The company develops ultrasonic touch solutions with precise, highly localised, buttonless interfaces that bring surfaces to life. The company has created the world's smallest ultrasound system-on-a-chip that can sense through any material and replace mechanical buttons in smartphones, consumer electronics, home appliances, automotive, IoT, industrial and medical products.