Infineon-Schweitzer develop chip embedding solution to increase EV range, cut system cost
With Schweitzer's p²Pack solution for embedding power semiconductors into PCBs, 48V MOSFETs are integrated into PCBs, resulting in a 35% increase in performance.
Semiconductor major Infineon Technologies and Schweizer Electronic AG have collaborated to increase the efficiency of silicon carbide (SiC)-based chips.
The two companies are developing a chip-embedding solution that embeds Infineon's 1200V CoolSiC chips directly into the PCB, which will increase the driving range of electric vehicles and reduce the total system cost. Both companies have already demonstrated the potential of this new approach. With Schweitzer's innovative p²Pack solution for embedding power semiconductors into PCBs, 48V MOSFETs are integrated into PCBs, resulting in a 35% increase in performance.
“Our common goal is to take automotive power electronics to the next level,” said Robert Hermann, Head of the High Voltage Discrete and Chip Product Line at Infineon Automotive. "The chip-embedding technology combined with the leading performance of the 1200V CoolSiC device enables highly integrated, high-efficiency inverters that reduce overall system cost."
“Using 100% electrically tested standard cells (S-Cells) from Infineon, we can achieve high overall yields in the p²Pack manufacturing process,” said Thomas Gottwald, vice president of technology at Schweizer Electronic. “The fast-switching characteristics of the p²Pack are optimally supported by the low inductance achievable with p²Pack, which improves the efficiency and reliability of power conversion devices such as traction inverters, DC-DC converters and on-board chargers.”
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