Denso and NEC plan JV to develop advanced in-vehicle kit
Denso Next will harness Denso’s advanced automotive engineering and manufacturing capabilities, and the NEC Group’s advanced technologies to design and develop advanced in-vehicle equipment.
Denso Corporation and NEC Platforms, a subsidiary of NEC Corporation, today unveiled a new joint venture, Denso Next Co. The company will develop in-vehicle information and communications equipment critical for fostering a truly connected environment inside vehicles, such as instrument clusters, head-up displays, and on-board communication equipment. The JV will start operations on December 1, 2017.
The recent cockpit innovation and advancement of connected technologies have made communication between products in the cabin more complicated, rapidly increasing the need to develop in-vehicle products more efficiently. Denso Next will harness Denso’s advanced automotive engineering and manufacturing capabilities, and the NEC Group’s advanced technologies and track record in the information and communications technology (ICT) business to quickly design and bring to market advanced in-vehicle equipment.
Denso Next will be located on the premises of NEC’s Tamagawa Plant in Kawasaki, Kanagawa, Japan. The innovations developed by Denso and NEC Platforms engineers will enable Denso to more efficiently produce existing information and communications equipment, and to create new products in line with vehicle cockpit advancements.
In December 2016, Denso and NEC started to collaborate in advanced driver assistance, automated driving, and manufacturing using AI and IoT. The two companies will take full advantage of technologies, products, and organizations created through the collaboration to help create a safe and secure automotive society for all people around the world.
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