Texas Instruments Launches Isolated Power Modules with Proprietary Packaging Technology

Texas Instruments (TI) has introduced two isolated power modules — the UCC34141-Q1 and UCC33420 — built around its proprietary IsoShield packaging technology. The company announced the products on March 24, 2026, at the Applied Power Electronics Conference (APEC) in San Antonio, Texas, one of the power electronics industry's foremost annual gatherings.

According to TI, the IsoShield technology co-packages a high-performance planar transformer and an isolated power stage within a single module, reducing solution size by as much as 70% compared to discrete component designs while delivering up to 2W of power. The modules support functional, basic, and reinforced isolation — a safety classification that matters in applications where a single component failure could compromise an entire system. By enabling a distributed power architecture, the modules are intended to help manufacturers meet functional safety standards that prohibit single-point failures.

The two modules differ primarily in size and voltage range. The UCC34141-Q1, designed for mid-voltage applications ranging from 6V to 20V, measures 5.85mm × 7.5mm × 2.6mm. The UCC33420 targets low-voltage 5V designs and occupies a smaller 4mm × 5mm × 1mm footprint, making it one of the more compact isolated power modules in TI's lineup. Both are available now in preproduction and production quantities through TI.com, with evaluation modules, reference designs, and simulation models also on offer to assist engineers during the design phase.

Power density has become a central constraint in both data center and automotive engineering. Data centers, under growing pressure to handle the computational demands of artificial intelligence workloads, require power systems that can deliver substantially more output without a proportional increase in physical space or cooling infrastructure. In electric vehicles, reducing the size and weight of power conversion components has a direct bearing on vehicle range, efficiency, and overall design flexibility. TI positions IsoShield as addressing both demands through advances in packaging rather than modifications to underlying chip architecture — a distinction that points to the limits engineers are increasingly encountering as transistor miniaturization slows.

"As chip sizes reach their physical limits and miniaturization increases in importance, advancements in packaging technology are enabling further performance and efficiency gains," the company stated in its announcement.

Isolated power designs present specific engineering challenges that distinguish them from non-isolated architectures. Isolation is required when circuits operating at different voltage levels or ground references must exchange signals or power without a direct electrical connection — a common requirement in automotive battery management systems, industrial motor drives, and data center server racks. Historically, achieving reinforced isolation has involved multiple discrete components, increasing board area, component count, and assembly complexity. Integrated modules that consolidate these functions have grown in use as a result, though prior generations have faced trade-offs between isolation performance and physical size.

TI is demonstrating the new modules at APEC in booth No. 1819, where they are featured as part of a 300kW automotive silicon carbide traction inverter reference design — a configuration relevant to high-voltage EV powertrains. The company is also debuting an 800V-to-6V DC/DC power distribution board incorporating gallium nitride integrated power stages, digital isolators, and microcontrollers, which TI describes as targeting next-generation data center computing trays equipped with AI processors. Pradeep Shenoy, TI's computing power technologist, is scheduled to present "Reimagining Data Center Power Architecture" at the conference on March 24.

The new modules extend a portfolio that TI says now exceeds 350 power module products. Its earlier MagPack technology, which integrates inductors rather than transformers, addressed non-isolated power designs. IsoShield extends that integrated packaging approach to isolated architectures, which carry stricter safety certifications and appear more frequently in automotive and industrial environments. The company has described its investment in power module innovation as a long-term strategic priority, with packaging increasingly cited alongside semiconductor process technology as a lever for performance improvement.

Kannan Soundarapandian, vice president and general manager of High Voltage Products at TI, said the new technology responds to demands for solutions that are smaller, more efficient, and faster to bring to market — reflecting broader industry pressure on design cycle times as applications in AI, electrification, and industrial automation continue to expand.

Texas Instruments is listed on Nasdaq under the ticker TXN. The company designs, manufactures, and sells analog and embedded processing chips across industrial, automotive, data center, personal electronics, and communications equipment markets, with manufacturing operations spanning multiple countries.