Microchip subsidiary and foundry partner deliver production-ready 28nm embedded flash solution for vehicle controllers
16 Jan 2026 | 219 Views | By Shristi Ohri
Silicon Storage Technology (SST), a Microchip Technology subsidiary, and United Microelectronics Corporation (UMC) announced the production release of their 28nm SuperFlash Gen 4 platform with full automotive grade 1 qualification.
The ESF4 technology integrates with UMC's 28HPC+ foundry process, targeting the growing market for advanced automotive controllers. The platform ...
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Silicon Storage Technology (SST), a Microchip Technology subsidiary, and United Microelectronics Corporation (UMC) announced the production release of their 28nm SuperFlash Gen 4 platform with full automotive grade 1 qualification.
The ESF4 technology integrates with UMC's 28HPC+ foundry process, targeting the growing market for advanced automotive controllers. The platform addresses industry demands for reliable data storage in increasingly connected and autonomous vehicles while reducing manufacturing complexity compared to competing solutions.
According to Mark Reiten, Vice President of Microchip's licensing business unit, the collaboration delivers a solution that helps developers meet efficiency requirements and accelerate time to market while satisfying stringent automotive standards. The platform is now ready for customer production designs.
Steven Hsu, Vice President of Technology Development at UMC, noted that automotive industry advancement toward connected and autonomous vehicles has driven customer demand for scaling SuperFlash technology to the 28nm process node.
The platform achieved Automotive Electronics Council Q-100 Grade 1 qualification, supporting operating temperatures from -40°C to +150°C. Key specifications include read access time under 12.5 nanoseconds, over 100,000 endurance cycles, and data retention exceeding 10 years at 125°C. The solution requires only 1-bit error correction code.
During qualification testing, a 32Mb macro demonstrated zero bit failures without error correction applied and achieved 100% peak yield under automotive grade 1 conditions.
The technology uses fewer masking steps than other 28nm high-k/metal-gate embedded flash offerings, providing cost advantages and improved manufacturing efficiency. Companies currently using 40nm ESF3 AG1 platforms can migrate to the new 28nm solution as they advance to smaller process nodes.
The platform supports applications requiring high-capacity controller firmware with over-the-air update capabilities, addressing expanding automotive market requirements.
Interested customers can access additional information through SST and UMC's respective websites or contact their regional sales representatives.