Government sanctions second tranche under Electronics Component Manufacturing Scheme, targeting ₹65,111 crore production and 11,808 jobs across nine states, while unveiling India's first energy-efficient edge chip.
17 Nov 2025 | 3439 Views | By Sarthak Mahajan
The Ministry of Electronics and Information Technology has approved 17 new proposals under the Electronics Component Manufacturing Scheme (ECMS), marking the second tranche of approvals aimed at strengthening India's electronics manufacturing capabilities.
The approved projects represent a total investment of ₹7,172 crore and are projected to generate cumulative production ...
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The Ministry of Electronics and Information Technology has approved 17 new proposals under the Electronics Component Manufacturing Scheme (ECMS), marking the second tranche of approvals aimed at strengthening India's electronics manufacturing capabilities.
The approved projects represent a total investment of ₹7,172 crore and are projected to generate cumulative production worth ₹65,111 crore while creating 11,808 direct employment opportunities. Combined with the earlier approval of seven applications worth ₹5,532 crore, the scheme continues to expand India's electronics component ecosystem.
The sanctioned units span nine states and union territories: Goa, Gujarat, Jammu & Kashmir, Karnataka, Madhya Pradesh, Maharashtra, Tamil Nadu, Uttar Pradesh, and Andhra Pradesh. This geographic distribution reflects the government's strategy to promote balanced regional development and establish high-skill manufacturing centers beyond major metropolitan areas.
Diverse Component Portfolio
The approved projects cover a broad spectrum of electronic components and sub-assemblies critical to multiple industries. Notable approvals include India's first optical transceiver manufacturing facilities by Jabil Circuit India Private Limited and Zetchem Supply Chain Services Private Limited.
Rakon India Private Limited will manufacture high-precision oscillators for timing applications in communication devices, computers, and industrial electronics. Aequs Consumer Products Private Limited has been approved to produce enclosures for laptops and smartwatches.
Camera module manufacturing will be undertaken by ASUX Safety Components India Private Limited, Uno Minda Limited, and Syrma Mobility Private Limited. TE Connectivity India Private Limited will manufacture connectors for electronic applications.
The scheme also approved nine companies for multi-layer printed circuit board (PCB) production: Hi-Q Electronics Private Limited, Secure Circuits Limited, Zetfab India Private Limited, Ehoome IOT Private Limited, Sierra Circuits (India) Private Limited, Meena Electrotech Private Limited, AT & S India Private Limited, Micropack Private Limited, and Infopower Technologies Private Limited.
Strategic Sectors Targeted
These components serve vital sectors including smartphones, IT hardware, wearables, telecommunications, electric vehicles, industrial electronics, defense, medical electronics, and renewable energy. The diversification addresses multiple segments of the electronics value chain simultaneously.
Minister of Electronics and IT Ashwini Vaishnaw stated that ECMS is facilitating the next phase of value chain integration, progressing from device assembly to component and sub-assembly manufacturing. He emphasized that the scheme positions India's electronics sector to achieve $500 billion in manufacturing value by 2030–31.
Industry Response
Approved applicants have commended the government's support under ECMS. Industry representatives highlighted the Ministry's proactive engagement, transparent approval processes, and expedited clearances as key factors in project advancement. They noted that the Ministry's responsive approach has enhanced industry confidence and reinforced India's standing as a reliable global manufacturing destination.
First Indigenous Edge Chip Launched
During the announcement event, Minister Vaishnaw also launched ARKA-GKT1, India's first-generation energy-efficient edge silicon chip. The System-on-Chip (SoC) was jointly developed by Cyient Semiconductors Pvt Ltd and Azimuth AI.
The Platform-on-a-Chip SoC integrates advanced computing cores, hardware accelerators, power-efficient architecture, and secure sensing capabilities into a single chip. It delivers up to 10 times better performance while reducing cost and complexity, with applications in smart utilities, smart cities, battery management systems, and industrial Internet of Things (IoT).
The chip launch demonstrates India's transition toward a product-driven, high-performance semiconductor ecosystem, complementing the country's manufacturing expansion efforts.
The Minister of State for Electronics and IT emphasized that ECMS reflects India's preparedness to compete with established global manufacturing centers and underscores the nation's commitment to building resilient and trusted supply chains.
The announcements were made at an event titled "Electronics Component Manufacturing Scheme: The Foundation for a Globally Competitive Electronics Value Chain," organized by the India Cellular & Electronics Association (ICEA).