To meet the increasing demand for premium driving experiences and connected in-vehicle services, Qualcomm Technologies has introduced new and enhanced solutions to its automotive technology portfolio.

The company says it has enhanced its Snapdragon Digital Chassis connected vehicle platforms by introducing a feature for Snapdragon Car-to-Cloud Services –Connectivity-as-a-Service –that brings new technology collaborations to support out-of-the-box connectivity, integrated analytics and a cloud and device developer environment aimed to deliver new technology features, content and services globally.

As integral components of the Snapdragon Digital Chassis, the Snapdragon Auto Connectivity Platform and Snapdragon Car-to-Cloud Services will help build connected and intelligent vehicles that are safer, customisable, immersive and continually upgradeable. The company also highlighted an integrated application framework for developing telematics and cloud-connected applications and services, the Snapdragon Telematics Applications Framework. Its new Wi-Fi 6E automotive chipset is engineered to increase bandwidth for Wi-Fi applications and deliver content at unmatched speeds.

Nakul Duggal, SVP and GM – Automotive, Qualcomm Technologies said, “At Qualcomm Technologies, we understand that automakers need unique, comprehensive and connected solutions to meet dynamic demands and power 21st century vehicles. By expanding our in-vehicle connectivity offerings to provide a transformative, scalable, extensive suite of solutions through the Snapdragon Digital Chassis, we are confident the automotive industry will be able to deliver the unmatched next-generation driving experiences customers deserve.”

Connectivity-as-a-Service is designed to support a highly customised user experience that can be continually refreshed throughout the vehicle lifecycle, Snapdragon Car-to-Cloud Services provide a seamless upgrade path with the ability to expand system performance and features, while also having the capability to enable new digital services. The connectivity-as-a-service expands these capabilities to provide global connectivity on Snapdragon Telematics SOC-based NAD modules along with an API-driven developer environment, creating on-device and cloud-enhanced apps/services. It is fuelled by telemetry data and advanced data insights from connected vehicles, the tools provided in the developer environment can help solve complexities that OEMs face when building connected services on telematics hardware.

• The company is also highlighting new technology collaborations to support Connectivity-as-a-Service and the delivery of new technology features and digital services globally. These new collaborations include:
• Cognizant, a leading professional services company using its global automotive cloud and device expertise to help transform automakers into modern enterprises. Leveraging its deep understanding of the auto industry and proven reusable components, ready-to-use test frameworks and system integration expertise, Cognizant will work with Qualcomm Technologies to integrate and tailor Snapdragon Car-to-Cloud Services for automakers, with the goal of delivering rich, immersive personalized in-vehicle experiences, new connected solutions and better on-demand services.
• Cubic Telecom, an award-winning global connectivity solutions provider. The solution created from Snapdragon Car-to-Cloud Services with Cubic’s software products (Pace, Insights and PLXOR) provides a single point of control for global out-of-the-box connectivity on Snapdragon Telematics SOC based NAD modules, with support for bundled data and services.  The solution also solves for regional regulation complexities with built-in compliance across regional markets.

Telematics Application Framework Integrated into the Snapdragon Auto Connectivity Platform, the Snapdragon Telematics Application Framework is utilised to simplify application development. Open source and scalable, this set of software tools is designed to seamlessly connect to Snapdragon Car-to-Cloud Services, allowing automotive developers to use telematics functionality across all platforms within the Snapdragon Digital Chassis. Through the Snapdragon Telematics Application Framework, developers can access a unified development environment with common application programming interfaces (APIs), which aids in reducing cost complexities when integrating technology features such as 5G, location services, memory and security into cloud-based applications and services.

Designed to address fragmentation and enable common application development across vehicle lines, the Snapdragon Telematics Application Framework is compatible with present and future platforms within the Snapdragon Digital Chassis. Anticipated to be available in early 2022, plus ongoing enhancements for new features and services, the new application framework allows developers to focus on their core expertise when creating applications that use telematics functionality to bring rich, immersive experiences with enhanced safety to modern vehicles.

Wi-Fi 6E Automotive Chipsets. To further increase bandwidth for connected applications and services, Qualcomm Technologies introduced the Qualcomm QCA6698AQ, a Wi-Fi 6E 4-Stream Dual Band Simultaneous (DBS) plus Bluetooth version 5.3 combination chip for automotive applications. Building on the latest Qualcomm FastConnect systems, the Qualcomm QCA6698AQ offers simultaneous 802.11ax Dual MAC operation in both 2.4Ghz and the expanded 5/6GHz band to enable one of the highest Wi-Fi speeds in an AEC-Q100 qualified device. Designed to address the complexity of today’s ultra-dynamic automotive ecosystem, the Qualcomm QCA6698AQ is engineered to deliver rich in-vehicle entertainment, exceptional audio experiences, and to dramatically increase bandwidth for concurrent Wi-Fi applications.

Till date, Snapdragon Digital Chassis and its integrated automotive platforms are claimed to be driving leadership and growth across telematics, infotainment and in-car connectivity, with an order pipeline of more than $13 billion (Rs 96,213 crore).