DuPont has announced that it has successfully completed the acquisition of Laird Performance Materials, a world leader in high-performance electromagnetic shielding and thermal management solutions. 

Ed Breen, Executive Chairman and CEO of DuPont, said: “The addition of Laird Performance Materials significantly strengthens the DuPont Electronics & Industrial (E&I) segment and is another meaningful step in advancing our strategy to grow as a global innovation leader and premier multi-industrial company. "

With 2020 revenues of $465 million and a global workforce of approximately 4,300 employees, Laird Performance Materials will be integrated into DuPont Electronics & Industrial’s Interconnect Solutions (ICS) business. Laird Performance Materials’ electromagnetic shielding and thermal management offerings complement ICS’ portfolio in flexible laminates, dry film photoresist, specialty films, and plating chemistries.

“This acquisition positions DuPont as an essential partner for major electronics OEMs by combining applied materials science expertise together with application engineering capabilities,” said Jon Kemp, President, DuPont E&I. “Together, the combined organisation will advance our leadership in accelerating the adoption of high-performance computing, artificial intelligence, 5G telecommunications, smart/autonomous vehicles, and the internet of things. It also expands our product and solution portfolio across the electronics value chain and builds our expertise in key technologies critical to enabling the next generation of electronic devices and infrastructure.”

With the addition of Laird Performance Materials, DuPont is well positioned to leverage its expanded customer base and global scale to increase speed to market, create new efficiencies in the development of integrated and multi-functional solutions, and provide high value next-generation products that will deliver additional growth over the next several years. The combined E&I organisation engages across value chains to address the increasingly complex challenges leading OEMs face in thermal management, signal integrity, miniaturisation, power management, and reliability.