Microchip Technology Launches Automotive-Grade System-in-Package Chip for Vehicle Display Applications
The SAM9X75D5M integrates a processor and DDR2 memory in a single package, targeting the growing market for in-vehicle human-machine interfaces.
Microchip Technology has announced the SAM9X75D5M, an AEC-Q100 Grade 2-qualified System-in-Package (SiP) designed for automotive and e-mobility applications. The device combines an Arm926EJ-S processor with 512 Mbit of DDR2 SDRAM in a single package and is priced at $9.12 each in quantities of 5,000 units.
The chip supports display sizes up to 10 inches at XGA resolution (1024 × 768 pixels) and offers multiple interface options — MIPI Display Serial Interface (DSI), Low Voltage Differential Signaling (LVDS), and parallel RGB data. Intended use cases include digital cockpit clusters, HVAC controls, EV chargers, and smart clusters for two- and three-wheelers.
By housing both the processor and memory in one package, the SAM9X75D5M reduces printed circuit board routing complexity and removes the need to source discrete DRAM components separately. Microchip says this approach offers more predictable supply availability at a time when discrete DDR memory markets have historically experienced volatility and procurement constraints.
Rod Drake, corporate vice president of Microchip Technology's MPU business unit, said the SiP provides more RAM buffer space than a traditional microcontroller implementation, and fits complex designs into a smaller board footprint than is possible with discrete memory components.
The device belongs to Microchip's hybrid MCU family, a product category positioned between conventional microcontrollers (MCUs) and full microprocessors (MPUs). This architecture is intended to give designers access to higher processing power and memory density while retaining development workflows common in MCU-based projects. The SAM9X75D5M supports Real-Time Operating Systems (RTOS), including FreeRTOS and Eclipse ThreadX, as well as Linux environments.
Connectivity features include CAN FD, USB, and Gigabit Ethernet with Time-Sensitive Networking (TSN) protocol support. The chip also carries integrated 2D graphics and audio capabilities.
The announcement comes as automotive manufacturers and tier-one suppliers increase investment in in-cabin display technology. Regulatory and consumer pressure for clearer driver information displays, combined with the growth of electric vehicles requiring new dashboard interfaces, has expanded demand for automotive-qualified display processors.
Development support is available through Microchip's MPLAB X IDE and MPLAB Harmony Software Framework. Third-party graphics tools — including Crank, LVGL, Altia, and Embedded Wizard — are also compatible. Hardware evaluation is supported by the SAM9X75 Curiosity LAN Kit. Larger memory variants of 1 Gbit and 2 Gbit are available for sampling.
Microchip Technology, headquartered in Chandler, Arizona, and listed on Nasdaq under the ticker MCHP, supplies semiconductors across the industrial, automotive, consumer, aerospace, defense, communications, and computing sectors.
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By Angitha Suresh
25 Mar 2026
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Autocar Professional Bureau
