STMicroelectronics introduced the ST SafeSense VD56GA, a 1.1 MP automotive image sensor for infrared in-cabin sensing, on October 13, 2026. The sensor is intended to help automotive OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration and cost.
It uses a new backside-illuminated pixel architecture, ST DeepNIR, and embedded image-processing functions. The release does not state a launch location. Samples are available now.
ST states that the VD56GA offers 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation. The company says it is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, including in challenging conditions such as under-display camera use.
“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.”
Anas Chalak, Market & Technology Analyst, Imaging at Yole Group, underlined the market context: “As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs.”
Cost Reduction
ST says the VD56GA is designed to reduce the cost of the complete camera module. According to the company, its imaging performance allows the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering and no external image processing. ST adds that in many in-cabin use cases, customers may meet performance targets without moving to a larger, more expensive sensor.
The sensor comes in a 3.7 mm x 3.2 mm CSP package, suited to space-constrained installations and next-generation in-cabin camera designs. It integrates mirror, crop, dark calibration, auto exposure and piecewise-linear processing functions.
ST says these remove the need for external image-processing resources, simplify camera design and speed development. The sensor supports RAW and YUV output formats, which allows use across different electronic architectures and software environments.
Front-end manufacturing of the VD56GA takes place at ST’s facility in Crolles, France, with packaging in Asia. Earlier this year, ST announced shipment of its 10 millionth SafeSense by ST automotive image sensor. The company reports adoption across Europe, Asia and the United States.