MAHLE has completed a pre-development project alongside semiconductor solutions supplier Infineon to design a high-performance electronic cooling unit. The custom thermal management system is engineered specifically for Infineon’s new EasyPACK S module, a component configured to control electric switchgear and power supply systems within data center infrastructures.
The technical collaboration targets heat dissipation issues associated with high-current electronic architectures. According to engineering specifications, the new power module delivers increased performance density within a compact footprint. MAHLE’s localized cooling unit is designed to mount directly onto the circuit board assembly, utilizing a dedicated coolant circuit to remove thermal energy from the operational modules to stabilize functional endurance and product durability.
The initial phase of the engineering project was completed over a four-month timeline, moving from initial design layouts to the production and dispatch of functional prototypes. Infineon is currently executing standard testing and product validation procedures on the supplied units to determine long-term baseline performance metrics.
Christian Kuechlin, Vice President of MAHLE Industrial and Special Solutions, said that the joint development initiative forms part of a broader corporate strategy to transition automotive thermal engineering competencies into industrial technology segments.